Midas / MDA-60MS Mask Aligner 4”

Micro/Nano Fabrication (Clean Room) Laboratory

Reservation

Top and backside alignment of Mask layers with substrate layers and patterning

Key Features

• Semi Auto System
• Auto exposure, Leveling and Z axis Stage motion
• Manual Alignment
• Beam size : 8.25” x 8.25”
• Sample Size : up to 6” wafer
• Wafer Stage : X,Y,Z and Θ 4 Axis motion
• Z, Θ Axis motorize
• Auto leveling of mask and sample
• Mask size : 7”x 7” max
• 1 KW UV Power Supply and UV lamp
• Dual CCD zoom microscope and 19” LCD Monitor
• Anti-Vibration Table

Light Source Module;

• 1 KW UV Lamp & 1KW Power supply
• Wavelength : NUV 350nm ~ 450nm
• 365nm Max. Intensity : max >30 mw/cm2
• Max. Beam Size : 8.25” x 8.25”
• Beam Uniformity : ≤ ±5%

Stage and Controller Module

• Exposure Time: 1 ~ 999.9 sec
• Stage movement: X,Y,Z and Theta X, Y : ±5 mm, Theta :±3°, Z : 15mm

Process
• Exposure Modes
• Vacuum Contact
• Pressure Contact: Hard / Soft
• Proximity Gap : 10 ~ 1000um
• Alignment Accuracy : TSA : < ±1 um ( @ Thin PR 1.2um )
• Alignment Accuracy : BSA : < ±3 um
• Resolution
• Vacuum Contact: 1um ( Thin PR@Si Wafer )
• Hard Contact : 2 um
• Soft contact : 3 um
• Proximity gap : 5 um

Standart Operating Procedure for Midas Mask Aligner 

Location

SUNUM building, Class 1000 Clean Room for Nanofabrication Lab (G131-G145)

For detailed information including Operation Conditions and Service Fees please contact: Onur Serbest : oserbest@sabanciuniv.edu

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