Micro & Nanofabrication Laboratory & Cleanroom

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OBJECTIVES AND SPECIFICATIONS

  • Class 100 – Class 10.000 (ISO 5,6,7) clean room for depositing organic and/or inorganic, conductive, insulating, and semi-conductive materials and etching (wet and dry) in controlled dimensions.
  • Fabrication of structures with dimensions from a few nanometers, to hundreds of micrometers on single or multi-level functional structures.
  • Multi-level and micro- and nano-system analyses and tests.

AREAS OF IMPACT AND APPLICATIONS

  • Fabrication of micro and nano-system prototypes in a wide field of applications such as communications, health, defense, environment, energy
  • Microfluidic circuits for chemical and biological sensor applications (such as chemical and biological sample separator and mixing)
  • Capacitive sensors arrays for sensor and Lab-on-a-Chip applications
  • Chemical sensor arrays for flammable, explosive and poisonous elements
  • Fabrication of RF microelectromechanic circuit elements (RF-MEMS Key, Filter, Resonator e.g.)
  • Infrared sensors/detectors
  • Capacitive, micro-processed, ultrasonic signal convertor/sensors
  • Optical circuit elements (e.g. Resonators, Reflectors, Filters)
  • Micro and nano manipulators
  • Micro and nano antennas for THz applications
  • Inertial sensors/converters/detectors: Gyroscope, Accelerometer

EQUIPMENT LIST

  • KLA-TENCOR P6 Surface Profiler
  • Semiconsoft Mprobe UVVis-NIR Thin Film Spectral Reflectance System
  • Cascade microtech PM5 Probe Station
  • Cascade microtech CP4 4-Point Probe
  • Despatch LCD1-16N-3 Photoresist Curing Ovens x4
  • Despatch LCD1-16N-3 Polyamide Curing Ovens x2
  • Kulicke and Sofa / 4700AD Ball and Wedge Wire Bonder
  • Mellen Crystal Growth Furnace
  • DISCO DAD 320 AutomaticDicingSaw
  • Vistec / EBPG5000plusES ElectronBeamLithographySystem
  • Torr E-beamandThermalEvaporator
  • TorrPlasmaAsher
  • Oxford PlasmaLabSystem 100 PECVD
  • Oxford PlasmaLabSystem 100 ICP 300 ICP RIE (III-V and Metal Ething)
  • Oxford PlasmaLabSystem 100 ICP 300 Deep RIE (SiO2,SiNx andDeep Si Etching)
  • SSI / Solaris 75-150Rapid ThermalAnnealer
  • Midas / MDA-60MS Mask Aligner 4"
  • Nanovak NVTE4-01 ThermalEvaporator
  • DorutekElectroplatingSystem (Gold andNickelElectroplatingSystem)
  • DorutekLithographyWetBench x 2 (Spinner, Hot Plate, Rinser)
  • DorutekEtching Station (Quartz, TeflonBaths, UltrasonicBath, QDR) x3
  • DorutekWetBench (UltrasonicBath, Bench Top Hot Plate) x1
  • DorutekFumeHood x1
  • Carl Zeiss Optical Microscopes
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