Materials Characterization

OBJECTIVES AND SPECIFICATIONS:

Raman Spectroscopy: Vibrational spectroscopic technique used to provide information on molecular vibrations and crystal structures, spectral and mapping analysis.
Ellipsometry: Measurements for thin metal and dielectic film diffraction constants and dielectic functions, optical constants, thin film thickness and total film thickness properties, surface roughness, absorption coefficient, optical band gap, transmittance and diffraction.
Fluorescence Spectroscopy: A type of electromagnetic spectroscopy that analyses fluorescence from a sample.
TGA/DTA: Thermogravimetric Analysis (TGA) is a technique in which the mass of a substance is monitored as a function of temperature or time as the sample specimen is subjected to a controlled temperature program in a controlled atmosphere.  Differential thermal analysis (DTA) is a technique in which the thermal effects in the material as a function of temperature are observed.
Microtomography: Provides 3D images of sample morphology and internal microstructure with resolution down to the sub-micron level via X Ray scanning.
UV-VIS Spectroscopy: Refers to absorption spectroscopy in the ultraviolet-visible spectral region which is used to determine analyte concentration either at one time or often over a desired time period.
Contact Angle Measurement: observes the wettability of a solid substrate by a liquid for determining the surface tension, hydrophilicity and contact angle of materials.
Light Microscopy: Uses visible light and a system of lenses to magnify images of materials without the need of sample preparation.

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AREAS OF IMPACT AND APPLICATIONS:

Vibratrional spectroscopy for determination of chemical bonds in organic/inorganic materials.

 

EQUIPMENT LIST

– Renishaw inVia Reflex Raman Microscope and Spectrometer
– J. A. Woollam Co. M2000 and VASE Ellipsometers
– Cary Eclipse Fluorescence Spectrophotometer
– UV-VIS Spectrophotometer
– TGA/DTA
– SkyScan Micro CT
– Theta lite Contact Angle Measurement System
– Zeiss Axio LIMI