At this special event, bringing together leading figures from industry and academia, critical topics such as next-generation 3D ICs, advanced packaging technologies, micro/nanofabrication, and sensor architectures will be discussed.
You are cordially invited to our workshop, where the latest developments and innovative approaches in advanced IC packaging techniques will be shared through presentations by distinguished faculty members and invited speakers.
Date: June 30, 2026
Time: 14:00–18:30
Location: SUNUM Foyer, Sabancı University Tuzla Campus
The workshop program is attached. Please confirm your participation by sending an email to eda.ozcan@sabanciuniv.edu.
Click here for the program.
